NK

Nobuyuki Kurashima

KT Kabushiki Kaisha Toshiba: 20 patents #1,460 of 21,451Top 7%
SC Shinko Electric Industries Co.: 20 patents #39 of 723Top 6%
JS Jsr: 2 patents #443 of 1,137Top 40%
Overall (All Time): #79,063 of 4,157,543Top 2%
40
Patents All Time

Issued Patents All Time

Showing 1–25 of 40 patents

Patent #TitleCo-InventorsDate
11592240 Loop-type heat pipe with vapor moving path in liquid pipe Yoshihiro Machida 2023-02-28
11384993 Heat pipe Yoshihiro Machida 2022-07-12
11333443 Loop heat pipe Koichi Tanaka, Yoshihiro Machida, Takahiko Kiso 2022-05-17
11143461 Flat loop heat pipe 2021-10-12
10962301 Loop heat pipe 2021-03-30
10712098 Loop heat pipe and method of manufacturing loop heat pipe 2020-07-14
10704838 Loop heat pipe Yoshihiro Machida 2020-07-07
10524388 Loop heat pipe and electronic device Yoshihiro Machida 2019-12-31
10495386 Loop heat pipe and electronic device Takahiko Kiso 2019-12-03
10497640 Heat pipe 2019-12-03
10408546 Loop heat pipe Yoshihiro Machida 2019-09-10
10352626 Heat pipe Yoshihiro Machida 2019-07-16
9137900 Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate Koichi Tanaka, Hajime Iizuka, Tetsuya Koyama 2015-09-15
9059088 Electronic component built-in substrate Tetsuya Koyama, Hajime Ilzuka, Koichi Tanaka 2015-06-16
9036362 Electronic component incorporated substrate Koichi Tanaka, Hajime Iizuka, Satoshi Shiraki 2015-05-19
8987919 Built-in electronic component substrate and method for manufacturing the substrate Koichi Tanaka, Hajime Iizuka, Satoshi Shiraki 2015-03-24
8736053 Semiconductor device Koichi Tanaka, Hajime Iizuka, Tetsuya Koyama 2014-05-27
8575030 Semiconductor device manufacturing method Gaku Minamihaba, Yukiteru Matsui, Hajime Eda 2013-11-05
8337715 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Dai Fukushima, Susumu Yamamoto, Hiroyuki Yano 2012-12-25
8174125 Manufacturing method of a semiconductor device Gaku Minamihaba, Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano 2012-05-08
7951717 Post-CMP treating liquid and manufacturing method of semiconductor device using the same Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano 2011-05-31
7842191 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Dai Fukushima, Susumu Yamamoto, Hiroyuki Yano 2010-11-30
7833431 Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device Gaku Minamihaba, Dai Fukushima, Yukiteru Matsui, Susumu Yamamoto, Hiroyuki Yano 2010-11-16
7827681 Method of manufacturing electronic component integrated substrate Tadashi Arai, Hajime Iizuka 2010-11-09
7825028 Method of manufacturing semiconductor device Gaku Minamihaba, Hiroyuki Yano 2010-11-02