DF

Dai Fukushima

KT Kabushiki Kaisha Toshiba: 25 patents #1,086 of 21,451Top 6%
Toshiba Memory: 5 patents #380 of 1,971Top 20%
EB Ebara: 1 patents #1,014 of 1,611Top 65%
JS Jsr: 1 patents #649 of 1,137Top 60%
Overall (All Time): #124,461 of 4,157,543Top 3%
30
Patents All Time

Issued Patents All Time

Showing 25 most recent of 30 patents

Patent #TitleCo-InventorsDate
11097397 Polishing device, polishing method, and record medium Takashi Watanabe, Takeshi Arakawa, Hiroaki Hayasaka, Tomonori Kawasaki 2021-08-24
10441979 Cleaning apparatus and cleaning method Jun Takagi, Jun Takayasu 2019-10-15
9902038 Polishing apparatus, polishing method, and semiconductor manufacturing method Jun Takayasu 2018-02-27
9849558 Polishing pad dresser, polishing apparatus and polishing pad dressing method Takayuki Nakayama 2017-12-26
9748090 Semiconductor manufacturing apparatus and manufacturing method of semiconductor device Shinichi Hirasawa 2017-08-29
9539696 Retainer ring, polish apparatus, and polish method Takashi Watanabe, Jun Takayasu 2017-01-10
9502318 Polish apparatus, polish method, and method of manufacturing semiconductor device Jun Takayasu, Takashi Watanabe 2016-11-22
9296083 Polishing apparatus and polishing method Jun Takayasu, Takashi Watanabe 2016-03-29
8778802 Polishing method and method for fabricating semiconductor device Gaku Minamihaba, Hiroyuki Yano 2014-07-15
8506362 Polishing apparatus and polishing method Atsushi Shigeta, Tamami Takahashi, Kenya Ito, Masaya Seki, Hiroaki Kusa 2013-08-13
8337715 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Nobuyuki Kurashima, Susumu Yamamoto, Hiroyuki Yano 2012-12-25
8174125 Manufacturing method of a semiconductor device Nobuyuki Kurashima, Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano 2012-05-08
8152598 Substrate treating method and substrate treating apparatus Atsushi Shigeta 2012-04-10
7842191 CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Nobuyuki Kurashima, Susumu Yamamoto, Hiroyuki Yano 2010-11-30
7833431 Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device Gaku Minamihaba, Nobuyuki Kurashima, Yukiteru Matsui, Susumu Yamamoto, Hiroyuki Yano 2010-11-16
7682975 Semiconductor device fabrication method Gaku Minamihaba, Hiroyuki Yano 2010-03-23
7521350 Manufacturing method of a semiconductor device Nobuyuki Kurashima, Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano 2009-04-21
7494931 Method for fabricating semiconductor device and polishing method Gaku Minamihaba, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto 2009-02-24
7465668 Method of manufacturing semiconductor device Gaku Minamihaba, Hiroyuki Yano 2008-12-16
7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device Gaku Minamihaba, Susumu Yamamoto, Hiroyuki Yano 2008-09-02
7307023 Polishing method of Cu film and method for manufacturing semiconductor device Gaku Minamihaba, Hiroyuki Yano, Susumu Yamamoto 2007-12-11
7144804 Semiconductor device and method of manufacturing the same Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano 2006-12-05
7042099 Semiconductor device containing a dummy wire Nobuyuki Kurashima, Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano 2006-05-09
6984582 Method of making semiconductor device by polishing with intermediate clean polishing Gaku Minamihaba, Hiroyuki Yano, Yoshikuni Tateyama 2006-01-10
6935928 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method Kazuhito Uchikura, Kazuo Nishimoto, Masayuki Hattori, Nobuo Kawahashi, Hiroyuki Yano +3 more 2005-08-30