Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6897143 | Method of manufacturing semiconductor device including two-step polishing operation for cap metal | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Tetsuo Matsuda, Hisashi Kaneko | 2005-05-24 |
| 6858936 | Semiconductor device having an improved construction in the interlayer insulating film | Gaku Minamihaba, Yoshikuni Tateyama, Hiroyuki Yano | 2005-02-22 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Tetsuo Matsuda, Hisashi Kaneko | 2003-08-26 |
| 6576554 | Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process | Yukiteru Matsui, Gaku Minamihaba, Hiroyuki Yano | 2003-06-10 |
| 6312321 | Polishing apparatus | Hiroyuki Yano, Gaku Minamihaba | 2001-11-06 |