Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283383 | Planarization method and planarization apparatus | Akifumi GAWASE, Yukiteru Matsui, Hajime Eda | 2019-05-07 |
| 9144879 | Planarization method and planarization apparatus | Akifumi GAWASE, Yukiteru Matsui, Hajime Eda | 2015-09-29 |
| 9012246 | Manufacturing method of semiconductor device and polishing apparatus | Hajime Eda, Yukiteru Matsui, Akifumi GAWASE | 2015-04-21 |
| 8871644 | Method of manufacturing semiconductor device | Yukiteru Matsui, Akifumi GAWASE | 2014-10-28 |
| 8778802 | Polishing method and method for fabricating semiconductor device | Dai Fukushima, Hiroyuki Yano | 2014-07-15 |
| 8754433 | Semiconductor device and method of manufacturing the same | Yukiteru Matsui, Hajime Eda, Masayoshi Iwayama, Minoru Amano, Masatoshi Yoshikawa +3 more | 2014-06-17 |
| 8703004 | Method for chemical planarization and chemical planarization apparatus | Yukiteru Matsui, Masako Kodera, Hiroshi Tomita, Akifumi GAWASE | 2014-04-22 |
| 8685857 | Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device | Yukiteru Matsui, Yoshikuni Tateyama, Hiroyuki Yano, Atsushi Shigeta | 2014-04-01 |
| 8575030 | Semiconductor device manufacturing method | Yukiteru Matsui, Nobuyuki Kurashima, Hajime Eda | 2013-11-05 |
| 8480915 | Method of manufacturing semiconductor device | Yukiteru Matsui | 2013-07-09 |
| 8337715 | CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device | Dai Fukushima, Nobuyuki Kurashima, Susumu Yamamoto, Hiroyuki Yano | 2012-12-25 |
| 8174125 | Manufacturing method of a semiconductor device | Nobuyuki Kurashima, Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano | 2012-05-08 |
| 7951717 | Post-CMP treating liquid and manufacturing method of semiconductor device using the same | Nobuyuki Kurashima, Yoshikuni Tateyama, Hiroyuki Yano | 2011-05-31 |
| 7842191 | CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device | Dai Fukushima, Nobuyuki Kurashima, Susumu Yamamoto, Hiroyuki Yano | 2010-11-30 |
| 7833431 | Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device | Nobuyuki Kurashima, Dai Fukushima, Yukiteru Matsui, Susumu Yamamoto, Hiroyuki Yano | 2010-11-16 |
| 7825028 | Method of manufacturing semiconductor device | Nobuyuki Kurashima, Hiroyuki Yano | 2010-11-02 |
| 7700489 | Method of manufacturing a semiconductor device | Yukiteru Matsui, Hiroyuki Yano, Atsushi Shigeta | 2010-04-20 |
| 7682975 | Semiconductor device fabrication method | Dai Fukushima, Hiroyuki Yano | 2010-03-23 |
| 7655559 | Post-CMP treating liquid and manufacturing method of semiconductor device using the same | Nobuyuki Kurashima, Hiroyuki Yano | 2010-02-02 |
| 7521350 | Manufacturing method of a semiconductor device | Nobuyuki Kurashima, Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano | 2009-04-21 |
| 7494931 | Method for fabricating semiconductor device and polishing method | Dai Fukushima, Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto | 2009-02-24 |
| 7465668 | Method of manufacturing semiconductor device | Dai Fukushima, Hiroyuki Yano | 2008-12-16 |
| 7459398 | Slurry for CMP, polishing method and method of manufacturing semiconductor device | Yukiteru Matsui, Hiroyuki Yano | 2008-12-02 |
| 7452819 | Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device | Yukiteru Matsui, Yoshikuni Tateyama, Hiroyuki Yano, Atsushi Shigeta | 2008-11-18 |
| 7435682 | Method of manufacturing semiconductor device | Yukiteru Matsui, Atsushi Shigeta, Hiroyuki Yano, Satoko Seta, Hirokazu Kato | 2008-10-14 |