GM

Gaku Minamihaba

KT Kabushiki Kaisha Toshiba: 62 patents #224 of 21,451Top 2%
JS Jsr: 6 patents #185 of 1,137Top 20%
Toshiba Memory: 1 patents #1,210 of 1,971Top 65%
Overall (All Time): #35,941 of 4,157,543Top 1%
63
Patents All Time

Issued Patents All Time

Showing 51–63 of 63 patents

Patent #TitleCo-InventorsDate
6794285 Slurry for CMP, and method of manufacturing semiconductor device Yukiteru Matsui, Hiroyuki Yano 2004-09-21
6790769 CMP slurry and method of manufacturing semiconductor device Nobuyuki Kurashima, Hiroyuki Yano 2004-09-14
6740590 AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING Hiroyuki Yano, Yukiteru Matsui, Katsuya Okumura, Akira Iio, Masayuki Hattori 2004-05-25
6720250 Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper Hiroyuki Yano 2004-04-13
6653267 Aqueous dispersion for chemical mechanical polishing used for polishing of copper Hiroyuki Yano, Masayuki Motonari, Masayuki Hattori, Nobuo Kawahashi 2003-11-25
6611060 Semiconductor device having a damascene type wiring layer Hiroshi Toyoda, Hiroyuki Yano, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko 2003-08-26
6576554 Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process Yukiteru Matsui, Hiroyuki Yano, Dai Fukushima 2003-06-10
6454819 Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device Hiroyuki Yano, Yukiteru Matsui, Katsuya Okumura, Masayuki Motonari, Masayuki Hattori +1 more 2002-09-24
6444139 Slurry for CMP and CMP method Hiroyuki Yano 2002-09-03
6375545 Chemical mechanical method of polishing wafer surfaces Hiroyuki Yano, Yukiteru Matsui, Nobuo Hayasaka, Katsuya Okumura, Akira Iio +2 more 2002-04-23
6312321 Polishing apparatus Dai Fukushima, Hiroyuki Yano 2001-11-06
6090699 Method of making a semiconductor device Hisako Aoyama, Kyoichi Suguro, Hiromi Niiyama, Hitoshi Tamura, Hisataka Hayashi +2 more 2000-07-18
5592024 Semiconductor device having a wiring layer with a barrier layer Hisako Aoyama, Kyoichi Suguro, Hiromi Niiyama, Hitoshi Tamura, Hisataka Hayashi +2 more 1997-01-07