| 6740590 |
AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING |
Hiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Masayuki Hattori |
2004-05-25 |
| 6565767 |
Polymer particles and polishing material containing them |
Masayuki Hattori, Masayuki Motonari |
2003-05-20 |
| 6454819 |
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device |
Hiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Masayuki Motonari +1 more |
2002-09-24 |
| 6409780 |
Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices |
Hiroyuki Yano, Nobuo Hayasaka, Katsuya Okumura, Masayuki Hattori, Kiyonobu Kubota |
2002-06-25 |
| 6375545 |
Chemical mechanical method of polishing wafer surfaces |
Hiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Nobuo Hayasaka, Katsuya Okumura +2 more |
2002-04-23 |
| 6068769 |
Aqueous dispersion slurry of inorganic particles and production methods thereof |
Masayuki Hattori, Masayuki Motonari |
2000-05-30 |
| 5202388 |
Process for producing hydrogenation product of ring-opening polymer |
Noboru Oshima, Yosihiro Ohira, Masao Sakamoto, Hiroshi Oka |
1993-04-13 |
| 5164469 |
Transparent resin material |
Kohei Goto, Zen Komiya, Noboru Yamahara, Masao Hisatomi, Hiroshi Oka |
1992-11-17 |
| 5053471 |
Transparent resin material |
Kohei Goto, Zen Komiya, Noboru Yamahara |
1991-10-01 |
| 4699938 |
Pressure-sensitive adhesive composition |
Yoshihiro Minamizaki, Yoshio Miki, Takayuki Yamamoto, Toshinori Sakagami |
1987-10-13 |
| 4246427 |
Process for producing methacrylic acid |
Naoki Andoh, Ituo Nishiwaki, Masatoshi Arakawa |
1981-01-20 |