Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7419910 | Slurry for CMP, polishing method and method of manufacturing semiconductor device | Dai Fukushima, Susumu Yamamoto, Hiroyuki Yano | 2008-09-02 |
| 7402521 | Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor | Yukiteru Matsui, Atsushi Shigeta, Hiroyuki Yano | 2008-07-22 |
| 7364667 | Slurry for CMP and CMP method | Hiroyuki Yano | 2008-04-29 |
| 7354861 | Polishing method and polishing liquid | Kenro Nakamura, Takeo Kubota | 2008-04-08 |
| 7332104 | Slurry for CMP, polishing method and method of manufacturing semiconductor device | Yukiteru Matsui, Hiroyuki Yano | 2008-02-19 |
| 7307023 | Polishing method of Cu film and method for manufacturing semiconductor device | Dai Fukushima, Hiroyuki Yano, Susumu Yamamoto | 2007-12-11 |
| 7307344 | Semiconductor device including a discontinuous film and method for manufacturing the same | Hiroyuki Yano, Nobuyuki Kurashima, Susumu Yamamoto | 2007-12-11 |
| 7198729 | CMP slurry and method of manufacturing semiconductor device | Nobuyuki Kurashima, Hiroyuki Yano | 2007-04-03 |
| 7166017 | Slurry for CMP, polishing method and method of manufacturing semiconductor device | Yukiteru Matsui, Hiroyuki Yano | 2007-01-23 |
| 7144804 | Semiconductor device and method of manufacturing the same | Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano | 2006-12-05 |
| 7138073 | Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry | Hiroyuki Yano | 2006-11-21 |
| 7071108 | Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function | Yukiteru Matsui, Hiroyuki Yano | 2006-07-04 |
| 7060621 | Slurry for CMP, polishing method and method of manufacturing semiconductor device | Yukiteru Matsui, Hiroyuki Yano | 2006-06-13 |
| 7052620 | Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device | Yukiteru Matsui | 2006-05-30 |
| 7042099 | Semiconductor device containing a dummy wire | Nobuyuki Kurashima, Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano | 2006-05-09 |
| 6995090 | Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device | Hiroyuki Yano, Nobuyuki Kurashima | 2006-02-07 |
| 6984582 | Method of making semiconductor device by polishing with intermediate clean polishing | Dai Fukushima, Hiroyuki Yano, Yoshikuni Tateyama | 2006-01-10 |
| 6945854 | Semiconductor device fabrication method and apparatus | Nobuyuki Kurashima | 2005-09-20 |
| 6935928 | Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method | Kazuhito Uchikura, Kazuo Nishimoto, Masayuki Hattori, Nobuo Kawahashi, Hiroyuki Yano +3 more | 2005-08-30 |
| 6924227 | Slurry for chemical mechanical polishing and method of manufacturing semiconductor device | Hiroyuki Yano, Nobuyuki Kurashima, Nobuo Kawahashi, Masayuki Hattori, Kazuo Nishimoto | 2005-08-02 |
| 6896590 | CMP slurry and method for manufacturing a semiconductor device | Hiroyuki Yano | 2005-05-24 |
| 6897143 | Method of manufacturing semiconductor device including two-step polishing operation for cap metal | Hiroshi Toyoda, Hiroyuki Yano, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko | 2005-05-24 |
| 6858936 | Semiconductor device having an improved construction in the interlayer insulating film | Dai Fukushima, Yoshikuni Tateyama, Hiroyuki Yano | 2005-02-22 |
| 6858539 | Post-CMP treating liquid and method for manufacturing semiconductor device | Yukiteru Matsui, Nobuyuki Kurashima, Hiroyuki Yano | 2005-02-22 |
| 6794286 | Process for fabricating a metal wiring and metal contact in a semicondutor device | Hisako Aoyama, Kyoichi Suguro, Hiromi Niiyama, Hitoshi Tamura, Hisataka Hayashi +2 more | 2004-09-21 |