Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955454 | Method for forming wiring on insulating resin layer | Kosaku Harayama, Hiroyuki Kato, Tetsuya Koyama | 2011-06-07 |
| 7937828 | Method of manufacturing wiring board | — | 2011-05-10 |
| 7919843 | Semiconductor device and its manufacturing method | — | 2011-04-05 |
| 7915078 | Manufacturing method for semiconductor device embedded substrate | Toshio Kobayashi, Tadashi Arai | 2011-03-29 |
| 7906833 | Semiconductor device and manufacturing method thereof | Yoshihiro Machida | 2011-03-15 |
| 7884453 | Semiconductor device and manufacturing method thereof | — | 2011-02-08 |
| 7884484 | Wiring board and method of manufacturing the same | Masahiro Sunohara, Hajime Iizuka, Tetsuya Koyama | 2011-02-08 |
| 7875499 | Method of manufacturing a stacked semiconductor apparatus | — | 2011-01-25 |
| 7847384 | Semiconductor package and manufacturing method thereof | Tsuyoshi Kobayashi, Tetsuya Koyama | 2010-12-07 |
| 7843059 | Electronic parts packaging structure | Toshio Gomyo, Yukiharu Takeuchi, Hidenori Takayanagi | 2010-11-30 |
| 7811857 | Method of manufacturing semiconductor device | Yoichi Harayama | 2010-10-12 |
| 7795127 | Electronic device manufacturing method and electronic device | — | 2010-09-14 |
| 7790359 | Plating method | — | 2010-09-07 |
| 7786580 | Semiconductor device and method for manufacturing the same | Yoshihiro Machida | 2010-08-31 |
| 7772689 | Semiconductor package with a conductive post and wiring pattern | Tsuyoshi Kobayashi, Tetsuya Koyama | 2010-08-10 |
| 7772118 | Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same | — | 2010-08-10 |
| 7763977 | Semiconductor device and manufacturing method therefor | — | 2010-07-27 |
| 7752750 | Method of forming wiring | — | 2010-07-13 |
| 7749889 | Manufacturing method of semiconductor device | Tadashi Arai | 2010-07-06 |
| 7732712 | Wiring board and method for manufacturing the same | — | 2010-06-08 |
| 7521283 | Manufacturing method of chip integrated substrate | Yoshihiro Machida | 2009-04-21 |
| 7498259 | Through electrode and method for forming the same | Nobuyuki Kurashima | 2009-03-03 |
| 7468292 | Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side | — | 2008-12-23 |
| 7459343 | Method of manufacturing semiconductor device and support structure for semiconductor substrate | — | 2008-12-02 |
| 7417311 | Semiconductor device and method of fabricating the same | — | 2008-08-26 |