Issued Patents All Time
Showing 1–25 of 244 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11920028 | Curable composition and method for producing curable composition | Takaaki Inoue | 2024-03-05 |
| 11174881 | Pressure resistant device and fluid pressure cylinder | Kazuhiko Matsumoto, Norifumi IMAI, Takahiro HIKASA | 2021-11-16 |
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2018-11-20 |
| 9879703 | Fluid pressure cylinder | — | 2018-01-30 |
| 9791202 | Refrigerator and vacuum heat insulating material for use in refrigerator | Yoshimasa Horio, Shinya Nagahata, Tarou Yamaguchi, Shuhei Sugimoto, Kazuya Nakanishi +4 more | 2017-10-17 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2017-09-19 |
| 9603253 | Wiring substrate, manufacturing method therefor, and semiconductor package | Tatsuaki Denda, Yasuyoshi Horikawa, Hiroshi Shimizu | 2017-03-21 |
| 9451702 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2016-09-20 |
| 9103114 | Vacuum heat insulation material and manufacturing method therefor | Shinya Kojima, Fumie Horibata, Tomohisa Tenra | 2015-08-11 |
| 8928130 | Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same | Hiroshi Shimizu, Toshiyuki Okabe, Yasuyuki Kimura, Kazutaka Kobayashi | 2015-01-06 |
| 8901580 | Package for mounting electronic components, electronic apparatus, and method for manufacturing the package | Tadashi Arai, Yasuyuki Kimura, Kazutaka Kobayashi | 2014-12-02 |
| 8890295 | Package for mounting a light emitting element including a flat plate-shaped electrode and method for manufacture | Toshiyuki Okabe, Tsuyoshi Kobayashi, Yasuyuki Kimura | 2014-11-18 |
| 8823097 | Protection device with a thin-film resistance connected to plural drain regions | Tsutomu Imoto | 2014-09-02 |
| 8793868 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2014-08-05 |
| 8482117 | Semiconductor device with electronic component incorporation substrate | Kazutaka Kobayashi, Tadashi Arai | 2013-07-09 |
| 8379401 | Wiring board, method of manufacturing the same, and semiconductor device having wiring board | — | 2013-02-19 |
| 8256530 | Method of processing rock with laser and apparatus for the same | Kazuyoshi Takayama, Kiyonobu Ohtani, Satoru Umezu | 2012-09-04 |
| 8232639 | Semiconductor-device mounted board and method of manufacturing the same | Takaharu Yamano, Takashi Kurihara | 2012-07-31 |
| 8164131 | Nonvolatile semiconductor memory device and method of manufacturing the same | Saori Hara | 2012-04-24 |
| 7989707 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2011-08-02 |
| 7985619 | Manufacturing method for semiconductor device embedded substrate | Tadashi Arai, Takaharu Yamano | 2011-07-26 |
| 7981724 | Manufacturing method for semiconductor device embedded substrate | Tadashi Arai, Takaharu Yamano | 2011-07-19 |
| 7915078 | Manufacturing method for semiconductor device embedded substrate | Tadashi Arai, Takaharu Yamano | 2011-03-29 |
| 7901986 | Wiring substrate, manufacturing method thereof, and semiconductor device | Tadashi Arai | 2011-03-08 |
| 7807510 | Method of manufacturing chip integrated substrate | — | 2010-10-05 |