Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322478 | Semiconductor device and semiconductor device array | Takaharu Yamano | 2022-05-03 |
| 11309224 | Folded substrate for stacked integrated circuit devices | Yasuyoshi Horikawa, Yoshihiro Kita, Hikaru Tanaka | 2022-04-19 |
| 10588533 | Bioelectrode component | Hideaki Sakaguchi | 2020-03-17 |
| 10319963 | Battery and method for producing the same | Kazuyuki Kubota, Mitsuhiro Aizawa | 2019-06-11 |
| 10257934 | Circuit board module | Kenichi Mori, Kazuyuki Kubota | 2019-04-09 |
| 10219745 | Sensor including a peelable insulation sheet | Norihito Konno, Tomoharu Fujii | 2019-03-05 |
| 9716053 | Semiconductor device, heat conductor, and method for manufacturing semiconductor device | Kei Murayama | 2017-07-25 |
| 9508670 | Semiconductor device including semiconductor chips stacked via relay substrate | Koji Hara | 2016-11-29 |
| 9245856 | Semiconductor device | Tomoharu Fujii | 2016-01-26 |
| 8827730 | Socket and semiconductor device provided with socket | — | 2014-09-09 |
| 8784118 | Connection terminal structure, method for manufacturing connection terminal structure, and connection terminal structure substrate | — | 2014-07-22 |
| 8735737 | Substrate having leads | Takehito Terasawa, Masakuni Kitajima | 2014-05-27 |
| 8419442 | Socket and method of fabricating the same | Yasuyoshi Horikawa, Kenji Mochizuki, Masato Tanaka | 2013-04-16 |
| 8294253 | Semiconductor device, electronic device and method of manufacturing semiconductor device, having electronic component, sealing resin and multilayer wiring structure | — | 2012-10-23 |
| 8179692 | Board having connection terminal | — | 2012-05-15 |
| 8152535 | Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board | — | 2012-04-10 |
| 8083529 | Socket | — | 2011-12-27 |
| 7972149 | Board with connection terminals | — | 2011-07-05 |
| 7220657 | Semiconductor wafer and semiconductor device provided with columnar electrodes and methods of producing the wafer and device | Tsuyoshi Kobayashi, Shinichi Wakabayashi | 2007-05-22 |
| 6667235 | Semiconductor device and manufacturing method therefor | — | 2003-12-23 |
| 6413404 | Method of forming bumps by electroplating | Takeo Kanazawa, Tsuyoshi Kobayashi | 2002-07-02 |
| 6184567 | Film capacitor and semiconductor package or device carrying same | Akira Fujisawa, Tsuyoshi Shibamoto, Tsuyoshi Kobayashi, Shoji Watanabe | 2001-02-06 |
| 6030512 | Device for forming bumps by metal plating | Takeo Kanazawa, Tsuyoshi Kobayashi | 2000-02-29 |