Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309224 | Folded substrate for stacked integrated circuit devices | Yasuyoshi Horikawa, Yoshihiro Ihara, Hikaru Tanaka | 2022-04-19 |
| 11019722 | Wiring substrate | Kenichi Mori | 2021-05-25 |
| 10510649 | Interconnect substrate | Hitoshi Kondo | 2019-12-17 |
| 9989504 | Simultaneous multicompound analysis method and simultaneous multicompound analysis program using mass spectrometry | Tsuyoshi Nakanishi, Masaki Yamada, Suzumi TOKUOKA | 2018-06-05 |
| 8513364 | Production method of water-absorbent resin | Masazumi Sasabe, Sumio Okuda, Yorimichi Dairoku, Shuji Kanzaki, Motohiro Imura | 2013-08-20 |