Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817381 | Semiconductor device | Kei Murayama, Amane KANEKO, Kiyoshi Oi | 2023-11-14 |
| 11706877 | Composite wiring substrate and semiconductor device | Shota Miki, Koyuki Kawakami, Kiyoshi Oi, Kei Murayama | 2023-07-18 |
| 10959328 | Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate | Naoki Kobayashi, Kei Murayama, Shota Miki | 2021-03-23 |
| 10319963 | Battery and method for producing the same | Kazuyuki Kubota, Yoshihiro Ihara | 2019-06-11 |
| 9488677 | Probe card having a wiring substrate | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda | 2016-11-08 |
| 9476913 | Probe card | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda | 2016-10-25 |
| 9470718 | Probe card | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda | 2016-10-18 |
| 9374889 | Interposer and electronic component package | Kei Murayama, Koji Hara | 2016-06-21 |
| 9137890 | Wiring board and light emitting device | Kazutaka Kobayashi, Hiroshi Shimizu, Mina Iwai | 2015-09-15 |
| 9006894 | Wiring board and light emitting device | Kazutaka Kobayashi, Yasuyoshi Horikawa, Koji Hara | 2015-04-14 |
| 8394678 | Semiconductor chip stacked body and method of manufacturing the same | Kei Murayama, Akinori Shiraishi | 2013-03-12 |
| 7884632 | Semiconductor inspecting device | Akinori Shiraishi, Mitsutoshi Higashi, Kei Murayama, Katsunori Yamagishi | 2011-02-08 |
| 7262076 | Method for production of semiconductor package | Mitsutoshi Higashi | 2007-08-28 |
| 6433415 | Assembly of plurality of semiconductor devices | Naohiro Mashino | 2002-08-13 |