Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11659667 | Wiring board and method of manufacturing wiring board | — | 2023-05-23 |
| 8179689 | Printed circuit board, method of fabricating printed circuit board, and semiconductor device | — | 2012-05-15 |
| 8101461 | Stacked semiconductor device and method of manufacturing the same | Akihito Takano | 2012-01-24 |
| 8007649 | Hydrophilic treatment method and wiring pattern forming method | — | 2011-08-30 |
| 8004382 | Inductor device, and method of manufacturing the same | — | 2011-08-23 |
| 7936568 | Capacitor built-in substrate and method of manufacturing the same and electronic component device | — | 2011-05-03 |
| 7929320 | Inductor built-in wiring board having shield function | — | 2011-04-19 |
| 7909976 | Method for filling through hole | — | 2011-03-22 |
| 7755910 | Capacitor built-in interposer and method of manufacturing the same and electronic component device | — | 2010-07-13 |
| 7655504 | Semiconductor device and method of manufacturing the same | — | 2010-02-02 |
| 7530163 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2009-05-12 |
| 7217888 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2007-05-15 |
| 7205230 | Process for manufacturing a wiring board having a via | — | 2007-04-17 |
| 7114251 | Method of producing of circuit board; for semiconductor device | — | 2006-10-03 |
| 7084009 | Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2006-08-01 |
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2005-09-13 |
| 6872634 | Method of manufacturing micro-semiconductor element | Naoyuki Koizumi, Takashi Kurihara | 2005-03-29 |
| 6815348 | Method of plugging through-holes in silicon substrate | — | 2004-11-09 |
| 6703310 | Semiconductor device and method of production of same | Mitsutoshi Higashi | 2004-03-09 |
| 6699787 | Semiconductor device and method of production of same | Mitsutoshi Higashi | 2004-03-02 |
| 6670269 | Method of forming through-hole or recess in silicon substrate | — | 2003-12-30 |
| 6661077 | Semiconductor device including primary connecting plug and an auxiliary connecting plug | — | 2003-12-09 |
| 6548891 | Semiconductor device and production process thereof | — | 2003-04-15 |
| 6545353 | Multilayer wiring board and semiconductor device | — | 2003-04-08 |
| 6507497 | Interposer for semiconductor, method for manufacturing the same and semiconductor device using such interposer | — | 2003-01-14 |