Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881794 | Electrostatic adsorption member and substrate fixing device | Hiroyuki Kobayashi, Akihiko Tateiwa | 2024-01-23 |
| 11848224 | Electrostatic chuck and substrate fixing device | Kazunori SHIMIZU, Kentaro Kobayashi | 2023-12-19 |
| 9646926 | Wiring substrate and method of manufacturing the same | Yuji Kunimoto, Jun Furuichi, Noriyoshi Shimizu | 2017-05-09 |
| 9412687 | Wiring substrate and method of manufacturing the same | Yuji Kunimoto, Jun Furuichi, Noriyoshi Shimizu | 2016-08-09 |
| 9386695 | Wiring substrate having multiple core substrates | Jun Furuichi, Akihiko Tateiwa | 2016-07-05 |
| 9198290 | Wiring substrate, method of manufacturing the same, and semiconductor device | Yuji Kunimoto | 2015-11-24 |
| 9159648 | Wiring substrate and manufacturing method thereof | Jun Furuichi, Yasuyoshi Horikawa | 2015-10-13 |
| 9078384 | Wiring substrate and method of manufacturing the same | Jun Furuichi, Akihiko Tateiwa | 2015-07-07 |
| 8907489 | Wiring substrate, method of manufacturing the same, and semiconductor device | Yuji Kunimoto | 2014-12-09 |
| 8692363 | Electric part package and manufacturing method thereof | Masahiro Kyozuka, Kenta Uchiyama | 2014-04-08 |
| 8659127 | Wiring substrate, semiconductor device and manufacturing method thereof | Akihiko Tateiwa | 2014-02-25 |
| 8481863 | Substrate and method for manufacturing the same | Akinori Shiraishi, Kei Murayama, Masahiro Sunohara, Mitsutoshi Higashi | 2013-07-09 |
| 8148738 | Semiconductor device having an element mounted on a substrate and an electrical component connected to the element | Kei Murayama, Mitsutoshi Higashi, Yuichi Taguchi, Akinori Shiraishi, Masahiro Sunohara | 2012-04-03 |
| 8120166 | Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Akihiko Tateiwa | 2012-02-21 |
| 8111954 | Module substrate including optical transmission mechanism and method of producing the same | Kiyoshi Oi, Akihiko Tateiwa | 2012-02-07 |
| 8053680 | Wiring board having efficiently arranged pads | Fumimasa Katagiri, Yasue Tokutake, Shigeaki Suganuma, Michio Horiuchi | 2011-11-08 |
| 8044429 | Light-emitting device and method for manufacturing the same | Mitsutoshi Higashi, Masahiro Sunohara, Yuichi Taguchi, Akinori Shiraishi, Kei Murayama +1 more | 2011-10-25 |
| 7963031 | Package for semiconductor device and method of manufacturing the same | Kiyoshi Oi, Akihiko Tateiwa | 2011-06-21 |
| 7897510 | Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same | Kei Murayama, Akinori Shiraishi, Masahiro Sunohara, Yuichi Taguchi, Mitsutoshi Higashi | 2011-03-01 |
| 7876036 | Light emitting apparatus and manufacturing method therefor | Yuichi Taguchi, Masahiro Sunohara, Hideaki Sakaguchi, Akinori Shiraishi, Kei Murayama +1 more | 2011-01-25 |
| 7838897 | Light-emitting device and method for manufacturing the same | Mitsutoshi Higashi, Masahiro Sunohara, Yuichi Taguchi, Akinori Shiraishi, Kei Murayama +1 more | 2010-11-23 |
| 7834438 | Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device | Akinori Shiraishi, Kei Murayama, Hideaki Sakaguchi, Masahiro Sunohara, Yuichi Taguchi +1 more | 2010-11-16 |
| 7825423 | Semiconductor device and method of manufacturing semiconductor device | Akinori Shiraishi, Yuichi Taguchi, Masahiro Sunohara, Hideaki Sakaguchi, Kei Murayama +1 more | 2010-11-02 |
| 7786597 | Multilayer wiring board and semiconductor device | Michio Horiuchi, Yasue Tokutake, Shigeaki Suganuma, Fumimasa Katagiri | 2010-08-31 |
| 7708613 | Method of producing light emitting apparatus | Yuichi Taguchi, Masahiro Sunohara, Hideaki Sakaguchi, Akinori Shiraishi, Kei Murayama +1 more | 2010-05-04 |