Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12082346 | Wiring board | — | 2024-09-03 |
| 11171080 | Wiring substrate | Takahiko Kiso | 2021-11-09 |
| 10383228 | Electronic component device and method for manufacturing the same | — | 2019-08-13 |
| 10098228 | Electronic component device and method for manufacturing the same | — | 2018-10-09 |
| 9941232 | Electronic component device | Satoshi Shiraki, Koichi Tanaka, Tomohiro Suzuki | 2018-04-10 |
| 9299678 | Semiconductor package and manufacturing method therefor | Toru Hizume, Akihiko Tateiwa | 2016-03-29 |
| 9142524 | Semiconductor package and method for manufacturing semiconductor package | Akihiko Tateiwa, Masato Tanaka | 2015-09-22 |
| 8941230 | Semiconductor package and manufacturing method | Akihiko Tateiwa, Yuji Kunimoto, Jun Furuichi | 2015-01-27 |
| 8901725 | Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Akihiko Tateiwa, Fumimasa Katagiri | 2014-12-02 |
| 8692363 | Electric part package and manufacturing method thereof | Naoyuki Koizumi, Kenta Uchiyama | 2014-04-08 |
| 7597929 | Method of manufacturing a wiring substrate | — | 2009-10-06 |
| 7329568 | Method of forming active device on substrate that includes embossing insulating resin layer with metal mold | — | 2008-02-12 |