Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9899304 | Wiring substrate and semiconductor device | Kei Imafuji, Keiji Yoshizawa, Hirokazu Yoshino | 2018-02-20 |
| 9515050 | Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components | Akihiko Tateiwa | 2016-12-06 |
| 9136220 | Semiconductor package and method for manufacturing the semiconductor package | — | 2015-09-15 |
| 9041211 | Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip | — | 2015-05-26 |
| 8786103 | Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer | Akihiko Tateiwa | 2014-07-22 |
| 8692363 | Electric part package and manufacturing method thereof | Naoyuki Koizumi, Masahiro Kyozuka | 2014-04-08 |
| 8450853 | Semiconductor device and a method of manufacturing the same, and an electronic device | — | 2013-05-28 |
| 8314347 | Wiring board with lead pins and method of producing the same | Akihiko Tateiwa, Yuji Kunimoto | 2012-11-20 |
| 8174109 | Electronic device and method of manufacturing same | — | 2012-05-08 |
| 8169072 | Semiconductor device, manufacturing method thereof, and electronic device | Akihiko Tateiwa | 2012-05-01 |