Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057384 | Wiring substrate and semiconductor device | Hiroshi Taneda, Yoshiki Akiyama, Kensuke Uchida | 2024-08-06 |
| 11605585 | Flexible substrate and semiconductor apparatus | — | 2023-03-14 |
| 10438883 | Wiring board and semiconductor device | — | 2019-10-08 |
| 9935043 | Interconnection substrate and semiconductor package | Satoshi Fujii | 2018-04-03 |
| 9899304 | Wiring substrate and semiconductor device | Keiji Yoshizawa, Hirokazu Yoshino, Kenta Uchiyama | 2018-02-20 |
| 9545016 | Wiring substrate and method for manufacturing wiring substrate | Noriyoshi Shimizu, Kiyoshi Ol, Hiromu Arisaka | 2017-01-10 |
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Katsumi Yamazaki, Noritaka Katagiri, Teruaki Chino | 2016-11-01 |
| 9210807 | Wiring substrate | Jun Yoshiike | 2015-12-08 |
| 9084339 | Wiring substrate and method of manufacturing the same | — | 2015-07-14 |
| 7901997 | Method of manufacturing semiconductor device | Takashi Ozawa, Seiji Sato, Masao Nakazawa, Mitsuyoshi Imai, Masatoshi Nakamura | 2011-03-08 |
| 7807560 | Solder bump forming method | Masao Nakazawa, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata +2 more | 2010-10-05 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating | Masaki Sanada, Masao Nakazawa | 2007-09-04 |
| 7261803 | Non-cyanogen type electrolytic solution for plating gold | Miwa Abe | 2007-08-28 |
| 7093356 | Method for producing wiring substrate | Tadashi Kodaira, Takeshi Chino, Jyunichi Nakamura, Miwa Abe | 2006-08-22 |