Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741647 | Wiring substrate, semiconductor device, and method of manufacturing wiring substrate | Shigetsugu Muramatsu | 2017-08-22 |
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Kei Imafuji, Katsumi Yamazaki, Teruaki Chino | 2016-11-01 |
| 6759600 | Multilayer wiring board and method of fabrication thereof | Toshinori Koyama | 2004-07-06 |
| 6350365 | Method of producing multilayer circuit board | Toshinori Koyama | 2002-02-26 |