Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741647 | Wiring substrate, semiconductor device, and method of manufacturing wiring substrate | Noritaka Katagiri | 2017-08-22 |
| 9084372 | Wiring substrate, light emitting device, and manufacturing method of wiring substrate | Hiroshi Shimizu, Yasuyoshi Horikawa | 2015-07-14 |
| 9029891 | Wiring substrate, light emitting device, and manufacturing method of wiring substrate | Hiroshi Shimizu, Kazutaka Kobayashi | 2015-05-12 |
| 9000474 | Wiring substrate, light emitting device, and manufacturing method of wiring substrate | Hiroshi Shimizu, Kazutaka Kobayashi | 2015-04-07 |
| 8835773 | Wiring board and method of manufacturing the same | Yasuhiko Kusama | 2014-09-16 |
| 8575495 | Wiring substrate, semiconductor device, and method for manufacturing wiring substrate | Satoshi Sunohara | 2013-11-05 |
| 8508050 | Wiring substrate, semiconductor device, and method for manufacturing wiring substrate | Satoshi Sunohara | 2013-08-13 |
| 8222532 | Method for manufacturing a wiring board | Yasuhiko Kusama | 2012-07-17 |
| 8115300 | Wiring substrate and manufacturing method thereof, and semiconductor apparatus | Tsuyoshi Kobayashi, Takashi Kurihara | 2012-02-14 |
| 8037596 | Method for manufacturing a wiring board | Yasuhiko Kusama | 2011-10-18 |
| 7438945 | Method of producing multilayer interconnection board | Katsumi Yamazaki | 2008-10-21 |
| 7183196 | Multilayer interconnection board and production method thereof | Masato Tanaka, Katsumi Yamazaki | 2007-02-27 |
| 7180182 | Semiconductor component | Tsuyoshi Kobayashi, Takuya Kazama | 2007-02-20 |
| 6998291 | Cost-reducing and process-simplifying wiring board and manufacturing method thereof | Tohru Hizume | 2006-02-14 |
| 6730859 | Substrate for mounting electronic parts thereon and method of manufacturing same | Kazunari Imai | 2004-05-04 |
| 6628527 | Mounting structure for electronic parts and manufacturing method thereof | Takuya Kazama | 2003-09-30 |
| 6465886 | Semiconductor device having circuit pattern and lands thereon | Michio Horiuchi | 2002-10-15 |
| 6455786 | Wiring board and manufacturing method thereof and semiconductor device | Michio Horiuchi, Shigeru Mizuno, Takashi Kurihara | 2002-09-24 |
| 6444494 | Process of packaging a semiconductor device with reinforced film substrate | Takashi Kurihara | 2002-09-03 |
| 6420664 | Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate | Yoshihiko Ogawa, Norio Kojima | 2002-07-16 |
| 6404214 | Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device | Michio Horiuchi, Takuya Kazama | 2002-06-11 |
| 6335493 | Multilayer wiring board | Michio Horiuchi | 2002-01-01 |
| 6256207 | Chip-sized semiconductor device and process for making same | Michio Horiuchi | 2001-07-03 |
| 6242799 | Anisotropic stress buffer and semiconductor device using the same | Michio Horiuchi | 2001-06-05 |
| 6110755 | Method for manufacturing semiconductor device | Hiroshi Miyagawa | 2000-08-29 |