Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485864 | Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method | Kei Imafuji, Katsumi Yamazaki, Noritaka Katagiri | 2016-11-01 |
| 9380712 | Wiring substrate and semiconductor device | — | 2016-06-28 |
| 8610292 | Resin sealing method of semiconductor device | — | 2013-12-17 |
| 8536715 | Semiconductor device and method of manufacturing the same | — | 2013-09-17 |
| 8436471 | Semiconductor package with its surface edge covered by resin | Akihiko Tateiwa, Fumimasa Katagiri | 2013-05-07 |
| 8431441 | Semiconductor package and method of manufacturing same | — | 2013-04-30 |
| 8368235 | Resin sealing method of semiconductor device | — | 2013-02-05 |
| 8344492 | Semiconductor device and method of manufacturing the same, and electronic apparatus | — | 2013-01-01 |
| 8334461 | Wiring board and electronic component device | Yuichi Taguchi, Kiyoshi Oi | 2012-12-18 |
| 8293576 | Semiconductor device and method of manufacturing the same | — | 2012-10-23 |
| 7985629 | Resin sealing method of semiconductor device | — | 2011-07-26 |
| 7928557 | Stacked package and method for manufacturing the package | Kiyoshi Oi | 2011-04-19 |