Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881794 | Electrostatic adsorption member and substrate fixing device | Hiroyuki Kobayashi, Naoyuki Koizumi | 2024-01-23 |
| 9515050 | Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components | Kenta Uchiyama | 2016-12-06 |
| 9386695 | Wiring substrate having multiple core substrates | Jun Furuichi, Naoyuki Koizumi | 2016-07-05 |
| 9299678 | Semiconductor package and manufacturing method therefor | Masahiro Kyozuka, Toru Hizume | 2016-03-29 |
| 9142524 | Semiconductor package and method for manufacturing semiconductor package | Masahiro Kyozuka, Masato Tanaka | 2015-09-22 |
| 9078384 | Wiring substrate and method of manufacturing the same | Jun Furuichi, Naoyuki Koizumi | 2015-07-07 |
| 9054082 | Semiconductor package, semiconductor device, and method for manufacturing semiconductor package | Noriyoshi Shimizu, Akio Rokugawa, Masato Tanaka | 2015-06-09 |
| 8994193 | Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor package | Masato Tanaka, Akio Rokugawa | 2015-03-31 |
| 8941230 | Semiconductor package and manufacturing method | Masahiro Kyozuka, Yuji Kunimoto, Jun Furuichi | 2015-01-27 |
| 8901725 | Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Masahiro Kyozuka, Fumimasa Katagiri | 2014-12-02 |
| 8786103 | Stacked chips package having feed-through electrode connecting the first and second semiconductor components via an adhesive layer | Kenta Uchiyama | 2014-07-22 |
| 8659127 | Wiring substrate, semiconductor device and manufacturing method thereof | Naoyuki Koizumi | 2014-02-25 |
| 8530753 | Fine wiring package and method of manufacturing the same | Yuji Kunimoto | 2013-09-10 |
| 8436471 | Semiconductor package with its surface edge covered by resin | Teruaki Chino, Fumimasa Katagiri | 2013-05-07 |
| 8399977 | Resin-sealed package and method of producing the same | Yuji Kunimoto | 2013-03-19 |
| 8314347 | Wiring board with lead pins and method of producing the same | Kenta Uchiyama, Yuji Kunimoto | 2012-11-20 |
| 8169072 | Semiconductor device, manufacturing method thereof, and electronic device | Kenta Uchiyama | 2012-05-01 |
| 8153479 | Method of manufacturing semiconductor package | Tohru Hizume | 2012-04-10 |
| 8120166 | Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Naoyuki Koizumi | 2012-02-21 |
| 8111954 | Module substrate including optical transmission mechanism and method of producing the same | Naoyuki Koizumi, Kiyoshi Oi | 2012-02-07 |
| 8017503 | Manufacturing method of semiconductor package | Kiyoshi Oi, Toru Hizume, Fumimasa Katagiri | 2011-09-13 |
| 7963031 | Package for semiconductor device and method of manufacturing the same | Naoyuki Koizumi, Kiyoshi Oi | 2011-06-21 |
| 7939377 | Method of manufacturing semiconductor element mounted wiring board | Fumimasa Katagiri | 2011-05-10 |
| 7133589 | Tape fiber and method for treating same | — | 2006-11-07 |
| 7016574 | Optical collimator structure | — | 2006-03-21 |