Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10779406 | Wiring substrate | — | 2020-09-15 |
| 9299678 | Semiconductor package and manufacturing method therefor | Masahiro Kyozuka, Akihiko Tateiwa | 2016-03-29 |
| 8017503 | Manufacturing method of semiconductor package | Kiyoshi Oi, Fumimasa Katagiri, Akihiko Tateiwa | 2011-09-13 |
| 6285087 | Resin-shield type semiconductor device | Noboru Sakaguchi, Yoshinori Miyajima | 2001-09-04 |
| 6150194 | Semiconductor device sealed with resin, and its manufacture | Noboru Sakaguchi, Yoshinori Miyajima | 2000-11-21 |