Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10477703 | Wiring board | — | 2019-11-12 |
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2018-11-20 |
| 9824963 | Wiring board, and semiconductor device | — | 2017-11-21 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2017-09-19 |
| 9736941 | Wiring substrate | — | 2017-08-15 |
| 9646926 | Wiring substrate and method of manufacturing the same | Jun Furuichi, Noriyoshi Shimizu, Naoyuki Koizumi | 2017-05-09 |
| 9451702 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2016-09-20 |
| 9412687 | Wiring substrate and method of manufacturing the same | Jun Furuichi, Noriyoshi Shimizu, Naoyuki Koizumi | 2016-08-09 |
| 9332658 | Wiring board, semiconductor device, and method for manufacturing wiring board | Noriyoshi Shimizu | 2016-05-03 |
| 9198290 | Wiring substrate, method of manufacturing the same, and semiconductor device | Naoyuki Koizumi | 2015-11-24 |
| 8941230 | Semiconductor package and manufacturing method | Masahiro Kyozuka, Akihiko Tateiwa, Jun Furuichi | 2015-01-27 |
| 8907489 | Wiring substrate, method of manufacturing the same, and semiconductor device | Naoyuki Koizumi | 2014-12-09 |
| 8793868 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2014-08-05 |
| 8736073 | Semiconductor device | — | 2014-05-27 |
| 8530753 | Fine wiring package and method of manufacturing the same | Akihiko Tateiwa | 2013-09-10 |
| 8410614 | Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same | — | 2013-04-02 |
| 8399977 | Resin-sealed package and method of producing the same | Akihiko Tateiwa | 2013-03-19 |
| 8318543 | Method of manufacturing semiconductor device | — | 2012-11-27 |
| 8314347 | Wiring board with lead pins and method of producing the same | Kenta Uchiyama, Akihiko Tateiwa | 2012-11-20 |
| 8110921 | Semiconductor package and method of manufacturing the same | — | 2012-02-07 |
| 7989707 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2011-08-02 |
| 7598608 | Mounting substrate | Atsunori Kajiki | 2009-10-06 |
| 5084288 | Premix for cooking by a microwave oven and process of preparation thereof | Masanori Yamamoto, Takako Kubo | 1992-01-28 |
| 4818545 | Food material-container combination | — | 1989-04-04 |
| 4705209 | Erectable container | Takeo Fujihara, Akira Yamatani, Masanori Yamamoto | 1987-11-10 |