Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9820391 | Wiring board | Noriyoshi Shimizu, Shoji Watanabe, Akio Rokugawa | 2017-11-14 |
| 9620446 | Wiring board, electronic component device, and method for manufacturing those | Noriyoshi Shimizu, Hiromu Arisaka, Akio Rokugawa | 2017-04-11 |
| 9520352 | Wiring board and semiconductor device | Hiromu Arisaka, Noriyoshi Shimizu, Akio Rokugawa | 2016-12-13 |
| 9455219 | Wiring substrate and method of manufacturing the same | Noriyoshi Shimizu, Wataru Kaneda, Akio Rokugawa | 2016-09-27 |
| 9380707 | Method of manufacturing wiring substrate | Noriyoshi Shimizu, Akio Rokugawa, Wataru Kaneda | 2016-06-28 |
| 9220167 | Wiring substrate, semiconductor device, and method of manufacturing wiring substrate | Noriyoshi Shimizu, Masato Tanaka, Akio Rokugawa | 2015-12-22 |
| 9167692 | Wiring board, semiconductor device, and method of manufacturing wiring board | Noriyoshi Shimizu, Akio Rokugawa | 2015-10-20 |
| 7964950 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2011-06-21 |
| 7691673 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2010-04-06 |
| 7573135 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2009-08-11 |
| 7545049 | Electronic parts packaging structure | Masahiro Sunohara, Kei Murayama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2009-06-09 |
| 7498200 | Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2009-03-03 |
| 7495745 | Patterning method and computer readable medium therefor | Keiji Yoshizawa, Masatoshi Akagawa | 2009-02-24 |
| 7307691 | Maskless direct exposure system and user interface | Kazunari Sekigawa, Kazutaka Kobayashi, Masatoshi Akagawa | 2007-12-11 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi | 2007-10-23 |
| 7057290 | Electronic parts packaging structure and method of manufacturing the same | Masahiro Sunohara, Kei Murayama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2006-06-06 |
| 6759600 | Multilayer wiring board and method of fabrication thereof | Noritaka Katagiri | 2004-07-06 |
| 6560863 | Method of producing wiring board | Mikiko Kobayashi, Atsuhiko Hattori | 2003-05-13 |
| 6350365 | Method of producing multilayer circuit board | Noritaka Katagiri | 2002-02-26 |
| 6254758 | Method of forming conductor pattern on wiring board | — | 2001-07-03 |