Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341088 | Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure | Noriyoshi Shimizu, Rie Mizutani, Masaya Takizawa, Yoshiki Akiyama | 2025-06-24 |
| 12168339 | Interior member for aircraft, manufacturing method of the same, and replacement method of the same | Makoto Hirai, Toshio Kozasa, Masayuki Kanemasu, Yukari Sakuragi, Kensuke Sakaki +1 more | 2024-12-17 |
| 12057384 | Wiring substrate and semiconductor device | Kei Imafuji, Yoshiki Akiyama, Kensuke Uchida | 2024-08-06 |
| 11792927 | Interconnect substrate | Rie Mizutani, Noriyoshi Shimizu, Masaya Takizawa, Yoshiki Akiyama | 2023-10-17 |
| 11729914 | Wiring board | Noriyoshi Shimizu, Rie Mizutani, Masaya Takizawa, Yoshiki Akiyama | 2023-08-15 |
| 11716810 | Wiring board | Masaya Takizawa, Rie Mizutani, Yoshiki Akiyama, Noriyoshi Shimizu | 2023-08-01 |
| 11117184 | Aircraft panel production method and aircraft panel production system | Makoto Hirai, Takuya Goto, Tsuyoshi Kaneko | 2021-09-14 |
| 10993322 | Circuit board, laminated circuit board, and method of manufacturing circuit board | Keigo Sato, Noriyoshi Shimizu | 2021-04-27 |
| 10905005 | Wiring board, laminated wiring board, and semiconductor device | Yukari Chino | 2021-01-26 |
| 10593621 | Semiconductor device with barrier layer | Keigo Sato | 2020-03-17 |