Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341088 | Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure | Hiroshi Taneda, Noriyoshi Shimizu, Rie Mizutani, Yoshiki Akiyama | 2025-06-24 |
| 11792927 | Interconnect substrate | Rie Mizutani, Noriyoshi Shimizu, Hiroshi Taneda, Yoshiki Akiyama | 2023-10-17 |
| 11729914 | Wiring board | Hiroshi Taneda, Noriyoshi Shimizu, Rie Mizutani, Yoshiki Akiyama | 2023-08-15 |
| 11716810 | Wiring board | Rie Mizutani, Hiroshi Taneda, Yoshiki Akiyama, Noriyoshi Shimizu | 2023-08-01 |
| 7230713 | Method for measuring gap of liquid crystal cell | Tomohiro Akada | 2007-06-12 |