Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341088 | Wiring board and semiconductor device each having non-photosensitive thermosetting encapsulating layer over photosensitive resin layer of interconnect structure | Hiroshi Taneda, Noriyoshi Shimizu, Masaya Takizawa, Yoshiki Akiyama | 2025-06-24 |
| 11792927 | Interconnect substrate | Noriyoshi Shimizu, Hiroshi Taneda, Masaya Takizawa, Yoshiki Akiyama | 2023-10-17 |
| 11729914 | Wiring board | Hiroshi Taneda, Noriyoshi Shimizu, Masaya Takizawa, Yoshiki Akiyama | 2023-08-15 |
| 11716810 | Wiring board | Masaya Takizawa, Hiroshi Taneda, Yoshiki Akiyama, Noriyoshi Shimizu | 2023-08-01 |
| 10804210 | Wiring board | — | 2020-10-13 |
| 10743403 | Wiring board | — | 2020-08-11 |