Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12267953 | Wiring board | Hideki Ito | 2025-04-01 |
| 10905005 | Wiring board, laminated wiring board, and semiconductor device | Hiroshi Taneda | 2021-01-26 |
| 9293406 | Semiconductor package and manufacturing method thereof | — | 2016-03-22 |
| 8552815 | High-frequency line structure for impedance matching a microstrip line to a resin substrate and method of making | Tomoharu Fujii | 2013-10-08 |