| 7696617 |
Package for semiconductor devices |
Kazuhiko Ooi, Tadashi Kodaira, Eisaku Watari, Shunichiro Matsumoto |
2010-04-13 |
| 7285856 |
Package for semiconductor devices |
Kazuhiko Ooi, Tadashi Kodaira, Eisaku Watari, Shunichiro Matsumoto |
2007-10-23 |
| 7196426 |
Multilayered substrate for semiconductor device |
Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino |
2007-03-27 |
| 7164198 |
Multilayered substrate for semiconductor device |
Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino |
2007-01-16 |
| 7093356 |
Method for producing wiring substrate |
Kei Imafuji, Tadashi Kodaira, Takeshi Chino, Miwa Abe |
2006-08-22 |
| 6988312 |
Method for producing multilayer circuit board for semiconductor device |
Shunichiro Matsumoto, Tadashi Kodaira, Hironari Aratani, Takanori Tabuchi, Takeshi Chino +1 more |
2006-01-24 |
| 6759739 |
Multilayered substrate for semiconductor device |
Tadashi Kodaira, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino |
2004-07-06 |