Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290570 | Wiring substrate | Tadashi Arai, Yoshikazu Hirabayashi, Hidetoshi ARAI | 2019-05-14 |
| 10121695 | Semiconductor device | Tadashi Arai, Yoshikazu Hirabayashi, Hidetoshi ARAI | 2018-11-06 |
| 7873245 | Optoelectric composite substrate and method of manufacturing the same | Hideki Yonekura | 2011-01-18 |
| 7807560 | Solder bump forming method | Kei Imafuji, Masao Nakazawa, Masaki Sanada, Sachiko Oda, Kinji Nagata +2 more | 2010-10-05 |
| 7801396 | Optoelectric composite substrate and method of manufacturing the same | Hideki Yonekura | 2010-09-21 |
| 7696617 | Package for semiconductor devices | Kazuhiko Ooi, Eisaku Watari, Jyunichi Nakamura, Shunichiro Matsumoto | 2010-04-13 |
| 7340121 | Optoelectric composite substrate and method of manufacturing the same | Hideki Yonekura | 2008-03-04 |
| 7285856 | Package for semiconductor devices | Kazuhiko Ooi, Eisaku Watari, Jyunichi Nakamura, Shunichiro Matsumoto | 2007-10-23 |
| 7196426 | Multilayered substrate for semiconductor device | Jyunichi Nakamura, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino | 2007-03-27 |
| 7164198 | Multilayered substrate for semiconductor device | Jyunichi Nakamura, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino | 2007-01-16 |
| 7093356 | Method for producing wiring substrate | Kei Imafuji, Takeshi Chino, Jyunichi Nakamura, Miwa Abe | 2006-08-22 |
| 6988312 | Method for producing multilayer circuit board for semiconductor device | Jyunichi Nakamura, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino +1 more | 2006-01-24 |
| 6759739 | Multilayered substrate for semiconductor device | Jyunichi Nakamura, Shunichiro Matsumoto, Hironari Aratani, Takanori Tabuchi, Takeshi Chino | 2004-07-06 |