Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290570 | Wiring substrate | Tadashi Arai, Hidetoshi ARAI, Tadashi Kodaira | 2019-05-14 |
| 10121695 | Semiconductor device | Tadashi Arai, Hidetoshi ARAI, Tadashi Kodaira | 2018-11-06 |
| 8379402 | Wiring board having lead pin, and lead pin | Kazuhiro Oshima, Shigeo Nakajima, Yoshitaka Matsushita | 2013-02-19 |
| 5080980 | Ceramic package for semiconductor device | Noboru Sakaguchi, Shinichi Wakabayashi, Yoshiro Nishiyama, Kunihiko Imai | 1992-01-14 |