Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9476138 | Composite plating liquid | Yoriyuki Suwa, Kenji Kawamura, Syuzo Aoki, Susumu Arai | 2016-10-25 |
| 9136200 | Heat radiating component and method of producing same | Yoriyuki Suwa, Kenji Kawamura, Syuzo Aoki | 2015-09-15 |
| 8362369 | Wiring board | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda | 2013-01-29 |
| 7901997 | Method of manufacturing semiconductor device | Takashi Ozawa, Seiji Sato, Mitsuyoshi Imai, Masatoshi Nakamura, Kei Imafuji | 2011-03-08 |
| 7807560 | Solder bump forming method | Kei Imafuji, Masaki Sanada, Sachiko Oda, Tadashi Kodaira, Kinji Nagata +2 more | 2010-10-05 |
| 7695638 | Regeneration process of alkaline permanganate etching solution and unit therefor | Norikazu Nakamura, Hidekazu Miyamoto, Kenji Miyazawa, Manabu Saito | 2010-04-13 |
| 7445965 | Method of manufacturing radiating plate and semiconductor apparatus using the same | Masatoshi Akagawa, Hideto Nakazawa | 2008-11-04 |
| 7402232 | Silver electroplating solution | Yoko Ogihara, Shinichi Wakabayashi | 2008-07-22 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating | Masaki Sanada, Kei Imafuji | 2007-09-04 |
| 7093825 | Handrail | Osamu Kawamura | 2006-08-22 |
| 6755957 | Method of plating for filling via holes | Kenji Nakamura | 2004-06-29 |
| 6398856 | Substitutional electroless gold plating solution, electroless gold plating method and semiconductor device | — | 2002-06-04 |
| 5961565 | Wheel drive torque controller | Taketoshi Kawabe, Osamu Isobe, Ikurou Notsu, Sadahiro Takahashi | 1999-10-05 |
| 5952939 | Vehicle collision prevention device | Sadahiro Takahashi | 1999-09-14 |
| 5909053 | Lead frame and method for manufacturing same | Katsuya Fukase, Takahiro Iijima, Shinichi Wakabayashi | 1999-06-01 |
| 5884987 | Antilock brake device | Taketoshi Kawabe, Osamu Isobe, Ikurou Notsu, Sadahiro Takhashi | 1999-03-23 |
| 5772289 | Vehicle braking force controller | Osamu Isobe, Sadahiro Takahashi, Ikurou Notsu | 1998-06-30 |
| 5656855 | Lead frame and method for manufacturing same | Katsuya Fukase, Takahiro Iijima, Shinichi Wakabayashi | 1997-08-12 |
| 5643433 | Lead frame and method for manufacturing same | Katsuya Fukase, Takahiro Iijima, Shinichi Wakabayashi | 1997-07-01 |
| 5384204 | Tape automated bonding in semiconductor technique | Kazuhito Yumoto, Norio Wakabayashi, Shinichi Wakabayashi, Norio Wada, Fumio Kuraishi +1 more | 1995-01-24 |
| 5258062 | Electroless gold plating solutions | Masaaki Yoshitani, Shinichi Wakabayashi | 1993-11-02 |
| 4717459 | Electrolytic gold plating solution | Yoshirou Nishiyama, Shinichi Wakabayashi | 1988-01-05 |
| 4576879 | Sealed lead acid battery | Michio Yashima, Shuuji Takahashi | 1986-03-18 |