Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894246 | Bonding apparatus and bonding method | Shintaro Sugihara | 2024-02-06 |
| 11482431 | Substrate processing apparatus and substrate processing method | Kimio Motoda, Norifumi Kohama, Yosuke Omori, Kenji Sugakawa | 2022-10-25 |
| 10964563 | Bonding apparatus and bonding method | Norifumi Kohama, Kimio Motoda | 2021-03-30 |
| 9469093 | Bonding apparatus, bonding system and bonding method | Goro Furutani, Satoshi Ookawa | 2016-10-18 |
| 9165803 | Bonding method, bonding apparatus and bonding system | Goro Furutani, Satoshi Ookawa | 2015-10-20 |
| 9093222 | Dye adsorption apparatus and dye adsorption method | Goro Furutani, Takashi Terada, Yoshiteru Fukuda | 2015-07-28 |
| 9005385 | Bonding apparatus, bonding system and bonding method | Goro Furutani, Satoshi Ookawa | 2015-04-14 |
| 5384204 | Tape automated bonding in semiconductor technique | Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Fumio Kuraishi +1 more | 1995-01-24 |
| 5365107 | Semiconductor device having tab tape | Fumio Kuraishi, Hirofumi Uchida | 1994-11-15 |
| 5183711 | Automatic bonding tape used in semiconductor device | Katsuya Fukase, Hirofumi Uchida | 1993-02-02 |
| 5087530 | Automatic bonding tape used in semiconductor device | Katsuya Fukase, Hirofumi Uchida | 1992-02-11 |
| 4957697 | Nuclear fuel rod support grid with generally S-shaped spring structures | — | 1990-09-18 |