Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100928 | Semiconductor device, semiconductor device package, and manufacturing methods thereof | Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara +1 more | 2024-09-24 |
| 11677211 | Semiconductor device, semiconductor device package, and manufacturing methods thereof | Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara +1 more | 2023-06-13 |
| 10833473 | Semiconductor device, semiconductor device package, and manufacturing methods thereof | Takuya Hashimoto, Eiichiro Okahisa, Katsuya Nakazawa, Shigeru Matsushita, Sumio Uehara +1 more | 2020-11-10 |
| 5859471 | Semiconductor device having tab tape lead frame with reinforced outer leads | Fumio Kuraishi, Mamoru Hayashi | 1999-01-12 |
| 5384204 | Tape automated bonding in semiconductor technique | Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Norio Wada, Fumio Kuraishi +1 more | 1995-01-24 |