Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6081426 | Semiconductor package having a heat slug | Yoshiki Takeda, Takemi Machida | 2000-06-27 |
| 6074567 | Method for producing a semiconductor package | Toshihisa Yoda, Mitsuharu Shimizu | 2000-06-13 |
| 5905634 | Semiconductor package having a heat slug | Yoshiki Takeda, Takemi Machida | 1999-05-18 |
| 5859471 | Semiconductor device having tab tape lead frame with reinforced outer leads | Kazuhito Yumoto, Mamoru Hayashi | 1999-01-12 |
| 5384204 | Tape automated bonding in semiconductor technique | Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Norio Wada +1 more | 1995-01-24 |
| 5365107 | Semiconductor device having tab tape | Norio Wada, Hirofumi Uchida | 1994-11-15 |
| 4809053 | Semiconductor device and lead frame used therefor | — | 1989-02-28 |