Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6074567 | Method for producing a semiconductor package | Fumio Kuraishi, Toshihisa Yoda | 2000-06-13 |
| 5854094 | Process for manufacturing metal plane support for multi-layer lead frames | Hirofumi Fujii, Yoshiki Takeda | 1998-12-29 |
| 5804422 | Process for producing a semiconductor package | Toshihisa Yoda | 1998-09-08 |
| 5576577 | Multi-layer lead-frame for a semiconductor device | Toshikazu Takenouchi, Kuniyuki Hori | 1996-11-19 |
| RE35353 | Process for manufacturing a multi-layer lead frame | Masakuni Tokita, Akira Kobayashi, Shinichi YAMAKAWA, Norihiro Masuda | 1996-10-22 |
| 5410180 | Metal plane support for multi-layer lead frames and a process for manufacturing such frames | Hirofumi Fujii, Yoshiki Takeda | 1995-04-25 |
| 5389816 | Multi-layer lead frame using a metal-core substrate | Masato Tanaka | 1995-02-14 |
| 5293301 | Semiconductor device and lead frame used therein | Masato Tanaka, Katsuya Fukase, Toshiyuki Murakami | 1994-03-08 |
| 5291060 | Lead frame and semiconductor device using same | Yoshiki Takeda, Hirofumi Fujii | 1994-03-01 |
| 5281556 | Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane | Yoshiki Takeda | 1994-01-25 |
| 5237202 | Lead frame and semiconductor device using same | Yoshiki Takeda, Hirofumi Fujii | 1993-08-17 |
| 5235209 | Multi-layer lead frame for a semiconductor device with contact geometry | Yoshiki Takeda, Hirofumi Fujii | 1993-08-10 |
| 5231756 | Process for manufacturing a multi-layer lead frame | Masakuni Tokita, Akira Kobayashi, Shinichi YAMAKAWA, Norihiro Masuda | 1993-08-03 |
| 5070390 | Semiconductor device using a tape carrier | — | 1991-12-03 |