Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6966742 | Work arrangement apparatus | Masatoshi Katayama | 2005-11-22 |
| 6271483 | Wiring board having vias | Michio Horiuchi, Toshiaki Suyama | 2001-08-07 |
| 5918746 | Carrier frame used for circuit boards | Mitsutoshi Higashi | 1999-07-06 |
| 5732465 | Method of manufacturing one side resin sealing type semiconductor devices | Mitsutoshi Higashi | 1998-03-31 |
| RE35353 | Process for manufacturing a multi-layer lead frame | Akira Kobayashi, Shinichi YAMAKAWA, Mitsuharu Shimizu, Norihiro Masuda | 1996-10-22 |
| 5231756 | Process for manufacturing a multi-layer lead frame | Akira Kobayashi, Shinichi YAMAKAWA, Mitsuharu Shimizu, Norihiro Masuda | 1993-08-03 |