Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5744758 | Multilayer circuit board and process of production thereof | Mikiko Wakabayashi | 1998-04-28 |
| 5576577 | Multi-layer lead-frame for a semiconductor device | Kuniyuki Hori, Mitsuharu Shimizu | 1996-11-19 |
| 5399809 | Multi-layer lead frame for a semiconductor device | — | 1995-03-21 |
| 4980754 | Package for superconducting devices | Seigo Kotani, Hiroyuki Sakai, Fumio Miyagawa | 1990-12-25 |
| 4890155 | Package for mounting a semiconductor chip of ultra-high frequency | Fumio Miyagawa, Hiroyuki Sakai | 1989-12-26 |