Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5557074 | Coaxial line assembly of a package for a high frequency element | Takaharu Miyamoto, Yoji Ohashi, Tamio Saito | 1996-09-17 |
| 5277357 | Process for making a metal wall of a package used for accommodating electronic elements | Takaharu Miyamoto, Tsutomu Higuchi | 1994-01-11 |
| 4980754 | Package for superconducting devices | Seigo Kotani, Hiroyuki Sakai, Toshikazu Takenouchi | 1990-12-25 |
| 4890155 | Package for mounting a semiconductor chip of ultra-high frequency | Hiroyuki Sakai, Toshikazu Takenouchi | 1989-12-26 |