Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8119930 | Wiring board and method for manufacturing the same | Junichi Nakamura | 2012-02-21 |
| 7923302 | Method for manufacturing a semiconductor package | Keisuke Ueda, Ryuichi Matsuki | 2011-04-12 |
| 7619316 | Semiconductor package and method for manufacturing the same | Keisuke Ueda, Ryuichi Matsuki | 2009-11-17 |
| 5557074 | Coaxial line assembly of a package for a high frequency element | Fumio Miyagawa, Yoji Ohashi, Tamio Saito | 1996-09-17 |
| 5277357 | Process for making a metal wall of a package used for accommodating electronic elements | Fumio Miyagawa, Tsutomu Higuchi | 1994-01-11 |