Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8804361 | Wiring substrate | Daisuke Takizawa | 2014-08-12 |
| 6081426 | Semiconductor package having a heat slug | Yoshiki Takeda, Fumio Kuraishi | 2000-06-27 |
| 5905634 | Semiconductor package having a heat slug | Yoshiki Takeda, Fumio Kuraishi | 1999-05-18 |