Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837574 | Bonding apparatus and bonding method | Yosuke Omori | 2023-12-05 |
| 11735465 | Substrate processing apparatus and substrate processing method | Yosuke Omori | 2023-08-22 |
| 11715663 | Bonding apparatus, bonding system, bonding method and recording medium | Yosuke Omori | 2023-08-01 |
| 11482431 | Substrate processing apparatus and substrate processing method | Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori | 2022-10-25 |
| 11164842 | Bonding apparatus and bonding system | Yosuke Omori | 2021-11-02 |
| 10985132 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori | 2021-04-20 |
| 10847495 | Bonding system and bonding method | Atsushi Nagata, Hiroshi Maeda | 2020-11-24 |
| 10756046 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori | 2020-08-25 |
| 10438918 | Bonding apparatus and bonding system | Yosuke Omori | 2019-10-08 |
| 10438920 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori | 2019-10-08 |
| 9741595 | Bonding method, storage medium, bonding apparatus and bonding system | Yuji Mimura, Shuhei Matsumoto, Takahiro Masunaga, Makoto Tsukishima | 2017-08-22 |