YO

Yoshitaka Otsuka

TL Tokyo Electron Limited: 10 patents #748 of 5,567Top 15%
OL Olympus: 5 patents #926 of 3,097Top 30%
MC Max Co.: 1 patents #201 of 321Top 65%
Overall (All Time): #281,673 of 4,157,543Top 7%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
12198963 Bonding system 2025-01-14
11817338 Bonding system and bonding method 2023-11-14
11417543 Bonding apparatus and bonding method Munehisa KODAMA, Yutaka Yamasaki 2022-08-16
10985132 Bonding apparatus, bonding system, bonding method and storage medium Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa 2021-04-20
10946419 Foreign substance removal apparatus and foreign substance detection apparatus Osamu Hirakawa 2021-03-16
10882234 Mold Hiroshi Yonekubo 2021-01-05
10833045 Substrate processing apparatus and manufacturing method of substrate holding unit Munehisa KODAMA, Takashi Terada 2020-11-10
10756046 Bonding apparatus, bonding system, bonding method and storage medium Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa 2020-08-25
10438920 Bonding apparatus, bonding system, bonding method and storage medium Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa 2019-10-08
10160015 Foreign substance removal apparatus and foreign substance detection apparatus Osamu Hirakawa 2018-12-25
10022926 Injection molding method and injection molding die Masaki Otsuka, Koki Iwasawa, Shigeya Sugata 2018-07-17
9925705 Molding die structure of molded article and manufacturing method of molded article 2018-03-27
9221222 Molding die for multicolored molding, molding method of multicolored molded piece, and multicolored molded piece Kazuhiro Kikumori, Akihiro Hatori 2015-12-29
9158037 Resin molded product, method of manufacturing the same, die for resin molded product Kazuhiro Kikumori 2015-10-13
8307778 Coating method and coating unit Toshifumi Inamasu, Fumihiko Ikeda, Kenya Shinozaki 2012-11-13
8272452 Hammering tool Kouji Katou, Terufumi Hamano, Akira Teranishi, Kazuya Sakamaki 2012-09-25