TI

Toshifumi Inamasu

TL Tokyo Electron Limited: 13 patents #516 of 5,567Top 10%
Overall (All Time): #363,588 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12381083 Bonding apparatus and bonding method Shinichi Shinozuka 2025-08-05
12308294 Bonding apparatus and bonding method Tetsuya Maki, Tatsumi Oonishi 2025-05-20
11804466 Substrate processing apparatus, substrate processing method and bonding method 2023-10-31
11658146 Bonding apparatus, bonding system, bonding method, and recording medium Takashi Nakamitsu, Shuhei Matsumoto 2023-05-23
11545383 Substrate positioning apparatus, substrate positioning method, and bonding apparatus Tetsuya Maki 2023-01-03
11348791 Bonding apparatus and bonding method Shinichi Shinozuka 2022-05-31
11094667 Bonding apparatus, bonding system, bonding method, and recording medium Takashi Nakamitsu, Shuhei Matsumoto 2021-08-17
10373847 Bonding apparatus 2019-08-06
10340248 Bonding systems Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura +2 more 2019-07-02
9468946 Wiping pad, and nozzle maintenance apparatus and coating treatment apparatus using wiping pad Yukio Ogasawara, Kei Tashiro 2016-10-18
8307778 Coating method and coating unit Fumihiko Ikeda, Kenya Shinozaki, Yoshitaka Otsuka 2012-11-13
7908995 Stage apparatus and application processing apparatus Tsuyoshi Yamasaki, Kazuhito Miyazaki 2011-03-22
7905195 Floating-type substrate conveying and processing apparatus Tsuyoshi Yamasaki, Kenya Shinozaki, Kimio Motoda 2011-03-15