Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658146 | Bonding apparatus, bonding system, bonding method, and recording medium | Shuhei Matsumoto, Toshifumi Inamasu | 2023-05-23 |
| 11488929 | Bonding apparatus, bonding system, bonding method, and recording medium | Shuhei Matsumoto, Yosuke Omori | 2022-11-01 |
| 11094667 | Bonding apparatus, bonding system, bonding method, and recording medium | Shuhei Matsumoto, Toshifumi Inamasu | 2021-08-17 |
| 10985132 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Yosuke Omori, Kenji Sugakawa | 2021-04-20 |
| 10756046 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Yosuke Omori, Kenji Sugakawa | 2020-08-25 |
| 10438920 | Bonding apparatus, bonding system, bonding method and storage medium | Yoshitaka Otsuka, Yosuke Omori, Kenji Sugakawa | 2019-10-08 |