Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322599 | Substrate processing method, modification device and substrate processing system | Takayuki Ishii | 2025-06-03 |
| 11721596 | Parameter adjustment method of bonding apparatus and bonding system | — | 2023-08-08 |
| 11574808 | Plasma processing method and plasma processing apparatus | Satoshi Itoh, Soudai EMORI, Nathan Ip | 2023-02-07 |
| 11482431 | Substrate processing apparatus and substrate processing method | Kimio Motoda, Norio Wada, Yosuke Omori, Kenji Sugakawa | 2022-10-25 |
| 10964563 | Bonding apparatus and bonding method | Norio Wada, Kimio Motoda | 2021-03-30 |