Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9392703 | Pad structure and mounted structure | Syota Miki | 2016-07-12 |
| 7807560 | Solder bump forming method | Kei Imafuji, Masao Nakazawa, Sachiko Oda, Tadashi Kodaira, Kinji Nagata +2 more | 2010-10-05 |
| 7384458 | Non-cyanide electroless gold plating solution and process for electroless gold plating | — | 2008-06-10 |
| 7264848 | Non-cyanide electroless gold plating solution and process for electroless gold plating | Masao Nakazawa, Kei Imafuji | 2007-09-04 |