Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8810007 | Wiring board, semiconductor device, and method for manufacturing wiring board | Masahiro Sunohara, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-08-19 |
| 8766101 | Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate | Ken Miyairi | 2014-07-01 |
| 8669643 | Wiring board, semiconductor device, and method for manufacturing wiring board | Masahiro Sunohara, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-03-11 |
| 8446013 | Wiring substrate and method for manufacturing the wiring substrate | Masahiro Sunohara, Takayuki Tokunaga, Hedeaki Sakaguchi | 2013-05-21 |
| 8101461 | Stacked semiconductor device and method of manufacturing the same | Naohiro Mashino | 2012-01-24 |
| 8058717 | Laminated body of semiconductor chips including pads mutually connected to conductive member | — | 2011-11-15 |
| 7358591 | Capacitor device and semiconductor device having the same, and capacitor device manufacturing method | Yasuyoshi Horikawa, Kiyoshi Oi | 2008-04-15 |
| 7319049 | Method of manufacturing an electronic parts packaging structure | Kiyoshi Oi, Yasuyoshi Horikawa | 2008-01-15 |
| 7161242 | Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element | Tomoo Yamasaki, Akio Rokugawa, Kiyoshi Ooi | 2007-01-09 |
| 6891732 | Multilayer circuit board and semiconductor device using the same | Takahiro Iijima | 2005-05-10 |
| 6754952 | Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated | Akira Fujisawa, Akio Rokugawa | 2004-06-29 |
| 6498714 | Thin film capacitance device and printed circuit board | Akira Fujisawa, Masayuki Sasaki | 2002-12-24 |