Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317426 | Laminated wiring board | — | 2025-05-27 |
| 11706877 | Composite wiring substrate and semiconductor device | Koyuki Kawakami, Kiyoshi Oi, Kei Murayama, Mitsuhiro Aizawa | 2023-07-18 |
| 11233001 | Adhesive layer bonding a plurality of substrates having a fillet raised portion | Naoki Kobayashi | 2022-01-25 |
| 10959328 | Wiring substrate, stacked wiring substrate, and manufacturing method of wiring substrate | Naoki Kobayashi, Kei Murayama, Mitsuhiro Aizawa | 2021-03-23 |
| 10485098 | Electronic component device | — | 2019-11-19 |
| 10340200 | Semiconductor device | — | 2019-07-02 |
| 9953958 | Electronic component device | — | 2018-04-24 |
| 9825006 | Electronic component device and manufacturing method thereof | — | 2017-11-21 |
| 9633978 | Semiconductor device and method of manufacturing the same | — | 2017-04-25 |