Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6413404 | Method of forming bumps by electroplating | Yoshihiro Ihara, Tsuyoshi Kobayashi | 2002-07-02 |
| 6030512 | Device for forming bumps by metal plating | Yoshihiro Ihara, Tsuyoshi Kobayashi | 2000-02-29 |